Thermal Stress and Strain in Microelectronics Packaging, Fachbücher von John Lau

John Lau | Thermal Stress And Strain In Microelectronics Packaging |

Usefulness and Precision of LCA in Microelectronics Packaging, Fachbücher

Fan-Out Wafer-Level Packaging, Fachbücher von John H. Lau

RF and Microwave Microelectronics Packaging II, Fachbücher von Rick Sturdivant, Ken Kuang

RF and Microwave Microelectronics Packaging, Fachbücher von Ken Kuang, Franklin Kim, Sean S. Cahill

Thermal Mismatch Stresses In Electronic Packaging 1661

John Lau 3d Ic Integration And Packaging (gebundene Ausgabe) (us

Rf And Microwave Microelectronics Packaging Ii 3559

Ken Kuang (u. A.) | Rf And Microwave Microelectronics Packaging |

John H. Lau Semiconductor Advanced Packaging (gebundene Ausgabe)

Modeling of Thermal Oxidation and Stress Effects, Fachbücher

John H. Lau | Semiconductor Advanced Packaging | Buch | Englisch

Evaluation of Stress, Strain and Deflection of Flexible Pavements, Fachbücher von Shiferaw Garoma

Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing, Fachbücher von Rusen Y...

John H. Lau | Fan-out Wafer-level Packaging | Taschenbuch | Englisch